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Oxy-acetylene equipment and gas supply

HARRIS L-CuP6 2,0 500 mm

Sample image, your configuration may differ.

Description

  • Copper-phosphorous alloy with excellent capillary properties
  • Thanks to its low viscosity, high working speeds are achieved
  • Good wetting ability, ensuring tight, pore-free connections
  • Composition and characteristics comply with the specifications of sections GW 2 and GW 7 of the DVGW (German Technical and Scientific Association for Gas and Water)
  • Applications
  • For brazing points at operating temperatures of -60 °C to 150 °C
  • Suitable for copper/copper or copper/copper alloy connections (brass, bronze, red bronze)
  • Flux can be dispensed with due to the phosphorus content
  • This solder is not suitable for use with sulphurous media or for connections involving steels (Fe) and nickel alloys
  • Copper installations: electrical engineering industry, air conditioning, refrigeration systems, heat exchangers, etc.

Technical data

StandardsISO 17672 - CuP 179
DIN EN 1044 - CP 203
DIN 8513 - L-CuP6
Ø2 mm
Chemical analysis
CuPOthers
Remainder5.9 % - 6.5 % - 0.25 %
Tensile strength, Rm250 N/mm²
Length500 mm
Melting range710 °C - 890 °C
Working temperature760 °C
Density8.1 g/cm³
VersionSquare, blank
Packing drum6 rods per package
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