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Oxy-acetylene equipment and gas supply

Dynaflow 2,0 500 mm

Sample image, your configuration may differ.

Description

  • Free-flowing, argentiferous copper-phosphorus solder for copper/copper connections without flux and for brass and copper alloys in conjunction with the Eco Smart flux<sup>®</sup></sup>
  • Low melting brazing filler with very high demands on the brazing joint and good flow properties
  • Applications
  • Dynaflow® was specially developed for refrigeration and air conditioning applications and is a cost-effective alternative to high-silver solders.
  • For brazing points at operating temperatures of -70 °C to 150 °C
  • Dynaflow® is also used in installation engineering and the electrical engineering industry
  • Dynaflow® is not suitable for connecting steels (brittle phase formation) and for use with sulphurous media

Technical data

Ø2 mm
Chemical analysis
CuPOthers
Remainder - 6.1 % - 0.15 %
Expansion, A510 %
Tensile strength, Rm250 N/mm²
Length500 mm
Melting range643 °C - 799 °C
Working temperature700 °C
Density8.4 g/cm³
VersionSquare, blank
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